KochChemie Micro Cut Hard Foam Pad
Couldn't load pickup availability
Description
High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut and Micro Cut & Finish.
The short height of 25mm creates low torsion forces, very good handling and the highest level of stability.
The special density of the foam material enables long-lasting compression hardness during polishing.
The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors.
The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.
The colourful non-woven material, suitable for polishing, ensures process safety.
Optimization of compression hardness and cell structure for high-solid paints.
